Enhancing Services through Advanced Simulation
What We Do
Power integrity analysis encompasses various types crucial for ensuring stable and reliable power distribution in electronic systems. DC analysis evaluates voltage drop and current distribution under steady-state conditions. AC analysis assesses impedance, resonance, and noise in the power delivery network (PDN) caused by high-frequency signals. Transient analysis studies the response to sudden load or voltage changes. Electromagnetic field analysis examines fields generated by power traces, vias, and planes, mitigating potential EMI. These analyses optimize PDNs, minimize voltage droops, and ensure system reliability.
Analysis Types
4 Analysis Types
Select an analysis type to explore the methodology, deliverables, and tools in detail.
ANALYSIS TYPE / 01
Enhancing Services through Advanced Simulation
Evaluates voltage drop and current distribution in the power delivery network (PDN) under steady-state conditions. DC IR drop analysis helps engineers identify regions where voltage levels fall below acceptable limits, ensuring that all components in the design receive adequate power for reliable operation.
Key Aspects
Evaluates voltage drop across power delivery networks under steady-state conditions to ensure all components receive adequate supply voltage within specification.
Analyses current density and distribution across power planes, traces, and vias to identify hotspots and potential reliability concerns in the PDN.
Identifies high-resistance paths and recommends layout improvements to minimize DCIR drop and ensure uniform power distribution across the design.
ANALYSIS TYPE / 02
Enhancing Services through Advanced Simulation
Assesses impedance, resonance, and noise in the PDN caused by high-frequency signals, ensuring signal integrity and minimizing electromagnetic interference (EMI). AC analysis evaluates the frequency-domain behavior of the power delivery network to ensure stable operation across all operating frequencies.
Key Aspects
Characterizes PDN impedance across frequency to ensure it remains below target impedance thresholds for all IC power domains, preventing excessive supply noise.
Identifies resonant peaks in the PDN caused by interactions between capacitors, planes, and inductance that can amplify noise at specific frequencies.
Assesses high-frequency noise propagation and recommends decoupling strategies to minimize electromagnetic interference and ensure signal integrity.
ANALYSIS TYPE / 03
Enhancing Services through Advanced Simulation
Studies the response of the PDN to sudden changes in load or voltage, identifying potential voltage fluctuations and ensuring proper decoupling capacitor placement. Transient analysis is critical for verifying that the PDN can respond quickly enough to dynamic load changes without causing voltage violations.
Key Aspects
Evaluates how quickly and accurately the PDN responds to sudden load current changes, identifying voltage overshoot, undershoot, and settling time issues.
Identifies voltage fluctuations that could impact IC performance or cause functional failures, particularly during simultaneous switching events.
Determines optimal type, value, and placement of decoupling capacitors to ensure adequate charge delivery during load transients and maintain PDN stability.
ANALYSIS TYPE / 04
Enhancing Services through Advanced Simulation
Examines electromagnetic fields generated by power traces, vias, and planes, assessing their impact on nearby components and mitigating potential EMI issues. Electromagnetic field analysis provides insight into how power distribution structures radiate and couple energy to sensitive signal nets and components.
Key Aspects
Maps electromagnetic fields generated by power traces, vias, and planes to understand radiation patterns and coupling to nearby signal structures.
Assesses the impact of power-related EM fields on nearby components, sensitive circuits, and signal nets to identify potential interference and functional risks.
Recommends layout modifications, shielding strategies, and routing changes to reduce electromagnetic emissions and ensure compliance with EMC standards.
Talk to our Centre of Excellence team about DCIR drop, AC impedance, transient response, or EMI challenges in your PCB or IC package design.
