Introduction to Electronics Thermal Management with Ansys Icepak

Overview

This symposium will provide a practical introduction to electronics thermal management using Ansys Icepak, focusing on the thermal and fluid-flow behaviour of electronic systems. Participants will understand the fundamentals of electronics cooling, heat transfer, airflow, and thermal simulation through guided demonstrations and hands-on exercises. This training will cover the typical Icepak workflow and introduces common applications including PCB assemblies, electronic components, heat sinks, fans, and enclosures. Participants will also learn best practices for model setup, convergence, and result interpretation, enabling them to perform a basic electronics thermal analysis and identify potential thermal management issues.

Who Should Attend

• Simulation Engineers
• R&D Engineers
• Thermal Engineers

Focused Industries

Key Highlights

• Electronics Cooling Fundamentals
• Practical Icepak Modelling
• Thermal Design Best Practices
• Hands-on Cooling Simulation

Agenda

1. 09:00 AM - 09:45 AM

   Introduction to Electronics Thermal Management and Icepak

2. 09:45 AM - 10:30 AM

   Interface and Modelling Basics

3. 10:30 AM - 11:15 AM

   Meshing

4. 11:15 AM - 12:00 PM

   Solving and Post-processing

5. 12:00 PM - 01:00 PM

   Workshop - Basic Electronics Cooling Simulation using Ansys Icepak