ANALYSIS TYPE / 05
current density · voltage drop · thermal hotspots
Overview
Performing DC analysis of power distribution networks to identify current crowding, excessive IR drop, and copper trace thermal hotspots — ensuring all power pins receive sufficient voltage and no trace segment exceeds thermal design limits.
Deliverables
Key Aspects
Mapping DC current distribution across power and ground planes to identify current crowding regions where copper resistance causes voltage drop and localised heating.
Evaluating current sharing across via arrays and identifying under-designed via connections that carry excessive current density relative to IPC-2152 current capacity guidelines.
Predicting Joule heating in high-current conductors to identify copper features approaching thermal limits and guide trace width or via count corrections.
Generating spatial voltage maps across all power rails to confirm that worst-case receiving IC power pins remain within datasheet minimum supply voltage specifications.
Connect with our power integrity team to discuss the right approach for your application.
