ANALYSIS TYPE / 03
High-Speed Interconnects · Crosstalk · Eye Diagram
Overview
Signal integrity analysis addresses reflections, crosstalk, impedance discontinuities, and electromagnetic emissions in high-speed digital interconnects — ensuring reliable data transmission in PCBs, packages, and system-level designs at multi-GHz data rates. From impedance discontinuity identification through eye diagram and jitter analysis to power delivery network validation, our engineers deliver a complete channel performance assessment that guides routing rules, decoupling strategy, and layout changes before board fabrication.
Industries Served
Deliverables
Key Aspects
Identifying vias, connectors, bends, and reference plane gaps that create impedance mismatches and generate reflections — recommending geometry changes to smooth the transmission line profile.
Computing near-end (NEXT) and far-end (FEXT) crosstalk between adjacent signal traces and differential pairs — guiding routing rules and spacing requirements.
Simulating complete channel performance at the bit rate of interest — generating eye diagrams, BER estimates, and jitter decomposition for compliance margin evaluation.
Evaluating decoupling capacitor placement, plane resonance, and target impedance compliance to ensure stable power delivery to high-speed ICs under switching transients.
Connect with our electromagnetics simulation team to discuss the right approach for your application.
