ANALYSIS TYPE / 09
Current Distribution · Joule Heating · EMI · Mechanical Stress
Overview
Busbar simulation analyses current density distribution, Joule heating, inductance, and mechanical stress under rated and fault conditions — ensuring reliable power distribution in EV battery systems, switchgear, and power electronics. Coupled electromagnetic-thermal analysis predicts thermal hotspots and stray inductance — a critical parameter for limiting voltage overshoot during SiC MOSFET switching — while short-circuit force analysis verifies structural integrity of the busbar assembly under fault conditions.
Industries Served
Deliverables
Key Aspects
Predicting the non-uniform current distribution in complex busbar geometries and identifying thermal hotspots under normal and peak current conditions.
Computing the frequency-dependent loop inductance of the busbar arrangement — critical for limiting voltage overshoot during IGBT and SiC MOSFET switching.
Coupling electromagnetic losses to thermal conduction to predict steady-state and transient temperature rise — verifying compliance with insulation temperature limits.
Simulating the extreme currents and resulting forces during short-circuit events — verifying structural integrity of the busbar assembly under fault conditions.
Connect with our electromagnetics simulation team to discuss the right approach for your application.
