ANALYSIS TYPE / 01
pre-compliance · far-field · EMC chamber correlation
Overview
Predicting radiated emissions from PCBs, cables, and enclosures before the first EMC chamber test — identifying dominant emission sources, frequencies, and antenna structures that drive non-compliance and enabling targeted layout corrections.
Deliverables
Key Aspects
Computing far-field radiated emission profiles from PCB and system models, comparing predicted emissions against CISPR 22/32, FCC Part 15, and automotive CISPR 25 limits.
Tracing dominant emission sources to specific PCB structures — switching regulators, clock lines, high-speed interfaces — quantifying each contributor's share of the total radiated emission budget.
Performing near-field to far-field transformation from board-level field scans or simulation data, enabling correlation with physical chamber measurements.
Providing a structured pre-compliance risk report identifying emission peaks most likely to fail chamber testing and prioritising corrective actions by impact and implementation effort.
Connect with our EMI/EMC engineering team to discuss the right approach for your application.
