A brand of the CADFEM Group
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Topic to be covered
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Speaker
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Duration
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|---|---|---|
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Registration
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08:30 - 09:15
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Opening Address
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Derrick Gan
Country Manager - CADFEM Malaysia Sdn Bhd |
09:15 - 09:20
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AI and Digital Engineering
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Dr.-Ing. Madhukar Chatiri
CEO - CADFEM APAC |
09:20 - 09:35
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Transformation Through Innovation in Automotive Semiconductor Packaging
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Dr. Eu Poh Leng
Senior Director, Package Innovation, Chef Technology Office NXP Malaysia Sdn Bhd |
09:35 - 10:05
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Advanced Packaging: From Afterthought to System Catalyst
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Mr. Desmond Lew
Sr. Staff Engineer, Advanced Packaging Design, Hanic Pte. Ltd. |
10:05 - 10:35
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Tea Break
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10:35 - 11:05
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The Application of Simulation in Semiconductor Test Solution Design
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Mr. TS Koay
Business Development Manager, Golden Etna Sdn Bhd. |
11:05 - 11:35
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Driving Semiconductor & Photonics Innovation:
Chip-to-System Integration with ANSYS
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Satish. S
Team Lead, Electronic Business Unit CADFEM APAC |
11:35 - 12:05
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Through Traditional Semiconductor Design to
Advancing Photonic Integration
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Eric Cheung
Application Engineer, Photonics and Optics Unit CADFEM SEA |
12:05 - 12:35
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Networking Lunch
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12:35 - 14:00
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An overview on Package warpage Study and Solder
Reflow Optimization techniques
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Shakthivel
Senior Application Engineer Mechanical Business Unit of CADFEM SEA |
14:00 - 14:30
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Simulation-Driven Reliability: Advanced SI & PI for
Next-Gen Systems
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Ooh Man Chun
Application Engineer Electronic Business Unit of CADFEM SEA |
14:30 - 15:00
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Rising complexity in SoC, IP and package integration, challenges across the design
chain and how the teams align across electrical, thermal and mechanical domains |
Dr. Yeap EC
Optics Photonics Test Engineer PentamasterCorporation Berhad Yap Hou Tatt Senior Signal Integrity and Power Integrity Engineer - Celestica Laguvaran Gunasegaran, Sr. R&D Manager of Thermal & Mechanical Simulation Lumileds |
15:00 - 16:00
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