The semiconductor industry is entering a new era of complexity with the rise of chiplets, 2.5D/3D IC integration, and advanced packaging. This event brings together leaders, engineers, and innovators to explore how Ansys multiphysics simulation is powering the next wave of semiconductor design and integration—tackling challenges in power, signal, thermal, and structural reliability across advanced packages.

Through keynotes, expert panels, and technical sessions, participants will gain insights into emerging trends—from co-packaged optics and photonic ICs to HBM and interposer design. More than just an event, it’s a chance for professionals to learn from experts, exchange ideas, and discover simulation-driven strategies to accelerate innovation and stay competitive in a rapidly evolving market.