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Webinar

Advanced Thermal Analysis and Simulation of Electronic Components and IC packages

Overview

As electronic components become more compact and power-dense, effective thermal management is critical to maintaining performance and reliability. This webinar will explore advanced thermal analysis and simulation techniques to optimize cooling strategies, reduce hotspots, and enhance product longevity. Register today to attend the webinar and learn all about the Thermal Analysis and Simulation of Electronic Components and IC packages.

Focused Industries

  • Automotive
  • Transportation & Mobility
  • Electronics & Semiconductor

Who Should Attend

  • Thermal Engineers & CFD Analysts working on electronics cooling
  • Professionals in the EV industry focusing on power electronics
  • Engineers in IC packaging, PCB design, and electronic enclosures

Key Highlights

  • PCB Thermal Modeling – Learn how to simulate and analyze heat dissipation in PCBs to prevent overheating.
  • Joule Heating and Electrothermal Coupling – Understand how electrical currents generate heat and its impact on circuit performance.
  • IC Package Thermal Modeling – Explore techniques for simulating heat transfer in IC packaging to optimize thermal efficiency.

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